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1

Design of a High-Speed Ethernet Connector for Harsh Environments

Boujmad, Younes, Bermond, Cedric, Artillan, Philippe, Gavard, Olivier, Prudhom, Marie, Khalili, Farsin, Husson-Charlet, Edith, Barbosa, Jean-Paul, Flechet, Bernard

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2020

Fichier:

PDF, 873 KB

2020

2

Introduction. Écriture de l’histoire et récit littéraire : actualités d’un débat

Fléchet, Anaïs, Haddad, Élie

Journal:

Revue d'histoire moderne et contemporaine

Année:

2018

Langue:

french

Fichier:

PDF, 941 KB

french, 2018

3

"Pelo que é nosso!": a diplomacia cultural brasileira no século XX

Dumont, Juliette, Fléchet, Anaïs

Journal:

Revista Brasileira de História

Année:

2014

Langue:

english

Fichier:

PDF, 115 KB

english, 2014

4

Performance predictions of interconnect networks for advanced technology nodes

M. Gallitre, A. Farcy, B. Blampey, C. Bermond, B. Fléchet, P. Ancey

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 667 KB

english, 2010

5

High frequencies characterization of Cu-MIM capacitors in parallel configuration for advanced integrated circuits

J. Piquet, C. Bermond, M. Thomas, B. Fléchet, A. Farcy, T.T. Vo, T. Lacrevaz, J. Torres, O. Cueto, G. Angénieux

Journal:

Microelectronic Engineering

Année:

2006

Langue:

english

Fichier:

PDF, 296 KB

english, 2006

6

Electrical Characterization of Advanced MIM Capacitors With Insulator for High-Density Packaging and RF Applications

Bertaud, T., Bermond, C., Blonkowski, S., Vallee, C., Lacrevaz, T., Farcy, A., Gros-Jean, M., Flechet, B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 1.56 MB

english, 2012

7

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

Brocard, M., Le Maitre, P., Bermond, C., Bar, P., Anciant, R., Farcy, A., Lacrevaz, T., Leduc, P., Coudrain, P., Hotellier, N., Ben Jamaa, H., Cheramy, S., Sillon, N., Marin, J-C., Flechet, B.

Année:

2012

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2012

8

[IEEE 2013 17th IEEE Workshop on Signal and Power Integrity (SPI) - Paris, France (2013.05.12-2013.05.15)] 2013 17th IEEE Workshop on Signal and Power Integrity - Fast estimation of high-speed signal integrity for coupled PCB interconnects

Eudes, Thomas, Ravelo, Blaise, Lacrevaz, Thierry, Flechet, Bernard

Année:

2013

Langue:

english

Fichier:

PDF, 209 KB

english, 2013

9

[IEEE 2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects (IMWS) - Guadalajara, Mexico (2009.02.19-2009.02.20)] 2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects - Impact of ULK Dielectric Loss on Interconnect Response for 45 nm Node Integrated Circuits

de Rivaz, S., Lacrevaz, T., Gallitre, M., Farcy, A., Blampey, B., Bermond, C., Flechet, B.

Année:

2009

Langue:

english

Fichier:

PDF, 2.70 MB

english, 2009

10

[IEEE Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. - Grenoble, France (12-16 Sept. 2005)] Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. - Simulation and characterization of high-frequency performances of advanced MIM capacitors

Piquet, J., Cueto, O., Charlet, F., Thomas, M., Bermond, C., Farcy, A., Torres, J., Flechet, B.

Année:

2005

Langue:

english

Fichier:

PDF, 491 KB

english, 2005

11

Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results

Lacrevaz, Thierry, Bermond, Cedric, El Bouayadi, Ossama, Houzet, Gregory, Artillan, Philippe, Lamy, Yann, Dieng, Khadim, Flechet, Bernard

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 2.66 MB

english, 2014

12

[IEEE ESSDERC 2007 - 37th European Solid State Device Research Conference - Muenchen, Germany (2007.09.11-2007.09.13)] ESSDERC 2007 - 37th European Solid State Device Research Conference - Design improvement of RF 3D MIM damascene capacitor

Capraro, S., Bermond, C., Vo, T.T., Piquet, J., Flechet, B., Thomas, M., Farcy, A., Torres, J., Cremer, S., Guichard, E., Haen, A.

Année:

2007

Langue:

english

Fichier:

PDF, 222 KB

english, 2007

13

Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si$_{3}$N$_{4}$ Dielectric Layers

Piquet, J., Bermond, C., Thomas, M., Farcy, A., Lacrevaz, T., Blampey, B., Torres, J., Flechet, B., Angenieux, G.

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2008

Langue:

english

Fichier:

PDF, 937 KB

english, 2008

14

A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains

Salik, R., Jun-Wu Tao,, Angenieux, G., Flechet, B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Année:

1996

Langue:

english

Fichier:

PDF, 732 KB

english, 1996

15

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations

Dieng, Khadim, Bermond, Cedric, Artillan, Philippe, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Lamy, Yann, Flechet, Bernard

Année:

2016

Langue:

english

Fichier:

PDF, 951 KB

english, 2016

16

Évaluation du profil de résistance des Escherichia coli uropathogènes isolés en laboratoires d’analyse de biologie médicale en Languedoc

Pantel, A., Flechet, L., Mion, P., Poirey, B., Coulon, C., Mirouze, E., Bayette, J., Sotto, A., Lavigne, J.

Journal:

Progrès en Urologie

Année:

2016

Langue:

french

Fichier:

PDF, 114 KB

french, 2016

17

Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers

Dieng, Khadim, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Perrier, Anne-Laure, Lamy, Yann, Flechet, Bernard

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2017

Langue:

english

Fichier:

PDF, 2.71 MB

english, 2017

18

[IEEE 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - Lake Maggiore, Italy (2017.5.7-2017.5.10)] 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - 3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer

Morot, Kevin, Farcy, Alexis, Lacrevaz, Thierry, Bermond, Cedric, Artillan, Philippe, Flechet, Bernard, Jacquinot, Helene, Scheiblin, Pascal

Année:

2017

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2017

19

IPAF – „Interstitial pneumonia with autoimmune features“; IPAF – interstitial pneumonia with autoimmune features;

Blum, T., Gerber, A., Fléchet, C., Griff, S., Großwendt, C., Rehbock, B., Rüssmann, H., Schönfeld, N., Bauer, T., Krause, A.

Journal:

Année:

2018

Langue:

german

Fichier:

PDF, 1.23 MB

german, 2018

20

Effets sur la digestion et le métabolisme des vaches laitières d'infusions d'acides gras volatils dans le rumen et de caséinate dans le duodénum. I. — Production et digestion

RULQUIN, H., FLECHET, Jeanne, LEFAIVRE, Renée, OLLIER, A., SORNET, Claire

Journal:

Reproduction Nutrition Development (Institut National De La Recherche Agronomique)

Année:

1982

Fichier:

PDF, 893 KB

1982

21

Impact of copper dummies on interconnect propagation performance in advanced integrated circuits

B. Blampey, B. Fléchet, C. Bermond, V. Fontaine, G. Angénieux, J. Torres, A. Farcy

Journal:

Microelectronic Engineering

Année:

2004

Langue:

english

Fichier:

PDF, 504 KB

english, 2004

22

Impact of process parameters on circuit performance for the 32 nm technology node

A. Farcy, M. Gallitre, V. Arnal, M. Sellier, L. Guibe, B. Blampey, C. Bermond, B. Fléchet, J. Torres

Journal:

Microelectronic Engineering

Année:

2007

Langue:

english

Fichier:

PDF, 645 KB

english, 2007

23

Quality factor and frequency bandwidth of 2D self-inductors in 3D integration stacks

J. Roullard, S. Capraro, E. Eid, L. Cadix, C. Bermond, T. Lacrevaz, A. Farcy, B. Flechet

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 776 KB

english, 2011

24

Wide band frequency and in situ characterization of high permittivity insulators (high-k) for high-speed integrated passives

T. Lacrevaz, B. Fléchet, A. Farcy, J. Torres, M. Gros-Jean, C. Bermond, O. Cueto, B. Blampey, G. Angénieux, J. Piquet, F. de Crécy

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 239 KB

english, 2005

25

Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives

T. Lacrevaz, B. Fléchet, A. Farcy, J. Torres, M. Gros-Jean, C. Bermond, T.T. Vo, O. Cueto, B. Blampey, G. Angénieux, J. Piquet, F. de Crécy

Journal:

Microelectronic Engineering

Année:

2006

Langue:

english

Fichier:

PDF, 429 KB

english, 2006

26

Impact of porous SiOCH on propagation performance measured for narrow interconnects of the 45 nm node

M. Gallitre, B. Blampey, B. Fléchet, A. Farcy, V. Arnal, C. Bermond, T. Lacrevaz, J. Torres

Journal:

Microelectronic Engineering

Année:

2007

Langue:

english

Fichier:

PDF, 1005 KB

english, 2007

27

Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors

T. Bertaud, C. Bermond, T. Lacrevaz, C. Vallée, Y. Morand, B. Fléchet, A. Farcy, M. Gros-Jean, S. Blonkowski

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 813 KB

english, 2010

28

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

B. Blampey, M. Gallitre, A. Farcy, T. Lacrevaz, S. De Rivaz, C. Bermond, B. Fléchet, V. Jousseaume, A. Zenasni, P. Ancey

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 731 KB

english, 2010

29

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

L. Cadix, C. Bermond, C. Fuchs, A. Farcy, P. Leduc, L. DiCioccio, M. Assous, M. Rousseau, F. Lorut, L.L. Chapelon, B. Flechet, N. Sillon, P. Ancey

Journal:

Microelectronic Engineering

Année:

2010

Langue:

english

Fichier:

PDF, 593 KB

english, 2010

30

Wideband frequency and in situ characterization of aluminum nitride (AlN) in a metal/insulator/metal (MIM) configuration

T. Bertaud, E. Defay, C. Bermond, T. Lacrevaz, J. Abergel, B. Salem, S. Capraro, B. Flechet

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 954 KB

english, 2011

31

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

E. Eid, T. Lacrevaz, C. Bermond, S. Capraro, J. Roullard, B. Fléchet, L. Cadix, A. Farcy, P. Ancey, F. Calmon, O. Valorge, P. Leduc

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2011

32

Characterization and optimization of a new Cu/SiN/TaN/Cu damascene architecture for metal–insulator–metal capacitors

M. Thomas, J. Piquet, A. Farcy, C. Bermond, J. Torres, T. Lacrevaz, B. Flechet, N. Casanova, C. Perrot, P. Caubet, B. Chenevier

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 362 KB

english, 2005

33

Impact of dummies on interconnects network HF propagation performances for the 65 nm node

B. Blampey, B. Fléchet, A. Farcy, M. Gallitre, C. Bermond, O. Cueto, J. Torres, G. Angénieux

Journal:

Microelectronic Engineering

Année:

2006

Langue:

english

Fichier:

PDF, 169 KB

english, 2006

34

Plasma exchange in corticosteroid-resistant pemphigus

J.C. Roujeau, B. Kalis, P. Lauret, M.L. Flechet, M.Joneau Fabre, C. Andre, J. Revuz, R. Touraine

Journal:

British Journal of Dermatology

Année:

1982

Langue:

english

Fichier:

PDF, 118 KB

english, 1982

35

Angioedema after ovine hyaluronidase injection for treating hyaluronic acid overcorrection

Pierre Andre, Marie Laure Fléchet

Journal:

Journal of Cosmetic Dermatology

Année:

2008

Langue:

english

Fichier:

PDF, 105 KB

english, 2008

36

Inflammatory nodular reactions after hepatitis B vaccination due to aluminium sensitization

A. Cosnes, M.-L. Flechet, J. Revuz

Journal:

Contact Dermatitis

Année:

1990

Fichier:

PDF, 319 KB

1990

37

Patch testing in severe cutaneous adverse drug reactions, including Stevens-Johnson syndrome and toxic epidermal necrolysis

Pierre Wolkenstein, Oliver Chosidow, Marie-Laure Fléchet, Odile Robbiola, Muriel Paul, Laurence Dume, Jean Renuz, Jean-Claude Roujeau

Journal:

Contact Dermatitis

Année:

1996

Fichier:

PDF, 484 KB

1996

38

[IEEE 2009 IEEE Workshop on Signal Propagation on Interconnects (SPI) - Strasbourg, France (2009.05.12-2009.05.15)] 2009 IEEE Workshop on Signal Propagation on Interconnects - High frequency characterization and modeling of high density TSV in 3D integrated circuits

Bermond, C., Cadix, L., Farcy, A., Lacrevaz, T., Leduc, P., Flechet, B.

Année:

2009

Langue:

english

Fichier:

PDF, 295 KB

english, 2009

39

Tests epicutanes: une batterie standard enfant ?

M Vigan, B Adessi, E Amoult, H Assier, M Avenel, A Barbaud, A Blondeel, JL Bourrain, P Bernard, M Castelain, E Collet, Y Dejobert, G Ducombs, ML Flechet, C Frick, F Giordano, P Girardin, A Goossens, G

Journal:

Revue Française d'Allergologie et d'Immunologie Clinique

Année:

2001

Fichier:

PDF, 142 KB

2001

40

L'intolérance aux cosmétiques

M.L. Flechet, Y. De Prost

Journal:

Revue Française d'Allergologie et d'Immunologie Clinique

Année:

1997

Fichier:

PDF, 316 KB

1997

41

In situ microwave characterisation of medium-k hfo2 and high-k srtio3 dielectrics for metal-insulator-metal capacitors integrated in back-end of line of integrated circuits

Vo, T.T., Lacrevaz, T., Bermond, C., Bertaud, T., Flechet, B., Farcy, A., Morand, Y., Blonkowski, S., Torres, J., Guigues, B., Defay, E.

Journal:

IET Microwaves Antennas & Propagation

Année:

2008

Langue:

english

Fichier:

PDF, 436 KB

english, 2008

42

Severe heparin and pentosan polysulfate - induced thrombocytopenias : Clinical aspects - in vitro effects of pentosan polysulfate, low molecular weight (LMW) heparins and oligosaccharides

J.Y. Borg, B. Fléchet, M. Legendre, F. Toulemonde, H. Piguet, M. Monconduit

Journal:

Thrombosis Research

Année:

1986

Langue:

english

Fichier:

PDF, 82 KB

english, 1986

43

[IEEE 1992 IEEE Microwave Symposium Digest MTT-S - Albuquerque, NM, USA (1-5 June 1992)] 1992 IEEE Microwave Symposium Digest MTT-S - A complete calibration procedure for time domain network analyzers

Ferrari, P., Angenieux, G., Flechet, B.

Année:

1992

Langue:

english

Fichier:

PDF, 358 KB

english, 1992

44

[IEEE 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Naples, Italy (2011.05.8-2011.05.11)] 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) - Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

Fourneaud, L., Lacrevaz, T., Charbonnier, J., Fuchs, C., Farcy, A., Bermond, C., Eid, E., Roullard, J., Flechet, B.

Année:

2011

Langue:

english

Fichier:

PDF, 428 KB

english, 2011

45

[IEEE 23rd European Microwave Conference, 1993 - Madrid, Spain (1993.10.4-1993.10.6)] 23rd European Microwave Conference, 1993 - Accurate and fast characterization of a class of quasiplanar structures

Tao, Jun-Wu, Angenieux, Gilbert, Flechet, Bernard

Année:

1993

Langue:

english

Fichier:

PDF, 3.44 MB

english, 1993

46

[IEEE 1993 IEEE MTT-S International Microwave Symposium Digest - Atlanta, GA, USA (14-18 June 1993)] 1993 IEEE MTT-S International Microwave Symposium Digest - Fullwave description of propagation and losses in quasiplanar transmission lines by quasi-analytical solution

Tao, J.-W., Angenieux, G., Flechet, B.

Année:

1993

Langue:

english

Fichier:

PDF, 299 KB

english, 1993

47

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Electrical performance modeling of unbalanced comb tree networks on advanced PCB interconnects for high-rate clock signal distribution

Eudes, Thomas, Ravelo, Blaise, Lacrevaz, Thierry, Flechet, Bernard

Année:

2013

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2013

48

[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits

Cadix, Lionel, Farcy, Alexis, Bermond, Cedric, Fuchs, Christine, Leduc, Patrick, Rousseau, Maxime, Assous, Myriam, Valentian, Alexandre, Roullard, Julie, Eid, Elie, Sillon, Nicolas, Flechet, Bernard,

Année:

2009

Langue:

english

Fichier:

PDF, 1.20 MB

english, 2009

49

Intercomparison of permittivity measurement techniques for ferroelectric thin layers

Queffelec, P., Laur, V., Chevalier, A., Le Floch, J.-M., Passerieux, D., Cros, D., Madrangeas, V., Le Febvrier, A., Députier, S., Guilloux-Viry, M., Houzet, G., Lacrevaz, T., Bermond, C., Fléchet, B.

Journal:

Journal of Applied Physics

Année:

2014

Langue:

english

Fichier:

PDF, 1.94 MB

english, 2014

50

Full-wave description of propagation and losses in quasi-planar transmission lines by quasi-analytical solution

Jun-Wu Tao,, Angenieux, G., Flechet, B.

Journal:

IEEE Transactions on Microwave Theory and Techniques

Année:

1994

Langue:

english

Fichier:

PDF, 720 KB

english, 1994